| Week |
Course Content |
| Week 1 |
Study the mechanical structure of existing ST MEMS accelerometers (e.g., LSM303AGR, mass-spring system). |
| Week 2 |
Design a cantilever structure adhering to1P6M design rules (e.g., minimum line width, interlayer dielectric materials) using finite element analyses. |
| Week 3 |
Simulate mechanical sensitivity (e.g., displacement vs. acceleration) and resonant frequency. |
| Week 4 |
3D model of the MEMS structure and simulation report (including stress analysis). |
| Week 5 |
Design a capacitive sensing circuit (e.g., differential capacitance-to-voltage converter), considering UMC 1P6M analog circuit constraints (e.g., parasitic capacitance). |
| Week 6 |
Use spice for circuit design and perform co-simulation with the MEMS structure using matlab. |
| Week 7 |
Optimize noise performance and signal chain (e.g., chopper stabilization). |
| Week 8 |
Circuit schematic and post-layout simulation results. |
| Week 9 |
Integrate MEMS and circuit layouts (GDSII file) and verify DRC/LVS using PDK. |
| Week 10 |
Propose a mock-up test plan (e.g., via TSRI’s MPW service). |
| Week 11 |
validate performance using Finite Element Analysis (FEA). |
| Week 12 |
validate performance using Finite Element Analysis (FEA). |
| Week 13 |
validate performance using Finite Element Analysis (FEA). |
| Week 14 |
Complete GDSII file |
| Week 15 |
Manufacturability report (including cost and yield estimates). |
| Week 16 |
Final report |
self-directed
learning |
01.Participation in professional forums, lectures, and corporate sharing sessions related to industry-government-academia-research exchange activities.
03.Preparing presentations or reports related to industry and academia.
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