NCHU Course Outline

Course Name	(中) 3DIC堆疊之晶圓接合(7505)
	(Eng.) Wafer Bonding Technology for 3D Integration
Offering Dept	Engineering
Course Type	Elective	Credits	1	Teacher	Undefined
Department	Engineering	Language	English	Semester	2024-FALL
Course Description	1. Bonding technology 2. Surface process for bonding 3. Surface/Interface Analysis Methods 4. Process flows for wafer boding technologies 5. Analysis methods for bonding interfaces
Prerequisites				self-directed learning in the course	N

Relevance of Course Objectives and Core Learning Outcomes(%)			Teaching and Assessment Methods for Course Objectives
Course Objectives	Competency Indicators	Ratio(%)	Teaching Methods	Assessment Methods
1. Bonding technology 2. Surface process for bonding 3. Surface/Interface Analysis Methods 4. Process flows for wafer boding technologies 5. Analysis methods for bonding interfaces			topic Discussion/Production Discussion Lecturing	Oral Presentation Quiz
Course Content and Homework/Schedule/Tests Schedule
Week Course Content Week 1 Introduction for Bonding Technologies Week 2 Surface / Interface Analysis for bonding (1) Microscopy Week 3 Surface / Interface Analysis for bonding (2) Crystallography Week 4 Surface / Interface Analysis for bonding (3) Spectroscopy-1 Week 5 Surface / Interface Analysis for bonding (4) Spectroscopy-2 Week 6 Assignments Week 7 Week 8 Week 9 Week 10 Week 11 Week 12 Week 13 Week 14 Week 15 Week 16 self-directed learning
Evaluation
To be determined
Textbook & other References
3D Process Technology, ed.Philip Garrou, Mitsumasa Koyanagi, Peter Ramm, Wiley-Blackwell, 2014
Teaching Aids & Teacher's Website
To be submitted
Office Hours
To be determined
Sustainable Development Goals, SDGs(Link URL)
include experience courses：N

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Update Date, year/month/day：2024/12/05 09:03:10	Printed Date, year/month/day：2025 / 4 / 27
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