NCHU Course Outline
Course Name (中) 專題討論(一)(6880)
(Eng.) Seminar (I)
Offering Dept INTENSE Overseas Master's Program in Semiconductor
Course Type Required Credits 2 Teacher LIN MENG CHANG
Department INTENSE Overseas Master's Program in Semiconductor/Graduate Language English Semester 2024-FALL
Course Description Throughout this course, students will learn assembly and packaging technologies for nanometers, silicon feature sizes, and beyond by group discussion. The evolution and impact of packaging on product performance and innovation will be discussed. Specifically, students will learn how packaging has enabled better products via heterogeneous integration by improving the interconnects for thermal management and signal integrity.
Prerequisites
self-directed learning in the course Y
Relevance of Course Objectives and Core Learning Outcomes(%) Teaching and Assessment Methods for Course Objectives
Course Objectives Competency Indicators Ratio(%) Teaching Methods Assessment Methods
(1)Addresses advanced semiconductor packaging both in theory and practice.
(2)Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging technologies.
(3)Provides in-depth treatment of packaging technologies.
Discussion
Attendance
Oral Presentation
Course Content and Homework/Schedule/Tests Schedule
Week Course Content
Week 1 Advanced Packaging
Week 2 System-in-Package (SiP)
Week 3 Fan-In Wafer/Panel-Level Chip-Scale Packages
Week 4 Fan-Out Wafer/Panel-Level Packaging
Week 5 2D, 2.1D, and 2.3D IC Integration
Week 6 2.5D IC Integration
Week 7 3D IC Integration and 3D IC Packaging(1)
Week 8 3D IC Integration and 3D IC Packaging(2)
Week 9 Hybrid Bonding(1)
Week 10 Hybrid Bonding(2)
Week 11 Chiplet Heterogeneous Integration(1)
Week 12 Chiplet Heterogeneous Integration(2)
Week 13 Low Loss Dielectric Materials(1)
Week 14 Low Loss Dielectric Materials(2)
Week 15 Advanced Packaging Trends(1)
Week 16 Advanced Packaging Trends(2)
Week 17 Participate in professional forums, lectures, enterprise sharing, and other industry-government-university-research-related activities. (Self-learning (1))
Week 18 Browse industrial and academic-related multimedia materials. (Self-learning (2))
Evaluation
Attendance & SELF-LEARNING (30%)
Oral Presentation (70%)
Textbook & other References
1. Semiconductor Advanced Packaging, John H. Lau, Springer.
2. Interconnect Reliability in Advanced Memory Device Packaging, Chong Leong, Gan and Chen-Yu, Huang, Springer.
Teaching Aids & Teacher's Website
https://lms2020.nchu.edu.tw/course/33481
Office Hours
Tuesday 15:00-17:00
Sustainable Development Goals, SDGs
08.Decent Work and Economic Growth   09.Industry, Innovation and Infrastructureinclude experience courses:N
Please respect the intellectual property rights and use the materials legally.Please repsect gender equality.
Update Date, year/month/day:2024/09/11 07:53:52 Printed Date, year/month/day:2024 / 10 / 07
The second-hand book website:http://www.myub.com.tw/