Relevance of Course Objectives and Core Learning Outcomes(%) |
Teaching and Assessment Methods for Course Objectives |
Course Objectives |
Competency Indicators |
Ratio(%) |
Teaching Methods |
Assessment Methods |
Learn various microfabrication technology for MEMS. Understand unique requirements for MEMS fabrication |
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Oral Presentation |
Assignment |
Quiz |
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Course Content and Homework/Schedule/Tests Schedule |
Week |
Course Content |
Week 1 |
Patterning by optical, X-Ray, and E-Beam lithography. |
Week 2 |
Patterning by optical, X-Ray, and E-Beam lithography. |
Week 3 |
Selective wet etching processes. |
Week 4 |
Selective wet etching processes. |
Week 5 |
Directional dry etching processes. |
Week 6 |
Directional dry etching processes. |
Week 7 |
Thin-film deposition by evaporation. |
Week 8 |
Thin-film deposition by evaporation. |
Week 9 |
Midterm Exam |
Week 10 |
Sputtering, electroplating, chemical vapor deposition, and laser assisted deposition. |
Week 11 |
Sputtering, electroplating, chemical vapor deposition, and laser assisted deposition. |
Week 12 |
Bonding and release of mechanical structures. |
Week 13 |
Bonding and release of mechanical structures. |
Week 14 |
Bulk and surface micromachining for MEMS. |
Week 15 |
Bulk and surface micromachining for MEMS. |
Week 16 |
Future trends and development in MEMS technology. |
Week 17 |
self-directed learning
Project Report |
Week 18 |
self-directed learning
Project Report |
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Evaluation |
Homework 10%, Oral Report 20%, Midterm Exams 30%, Final Exam 30% |
Textbook & other References |
1. S. D. Senturia, Microsystem Design, 2001, Kluwer Academic Publishing.Required Text:
2. S. A. Campbell, “The Science and Engineering of Microelectronic Fabrication”, Oxford, 2001.
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Teaching Aids & Teacher's Website |
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Office Hours |
週二10:00-12:00, 週三15:00-17:00 |
Sustainable Development Goals, SDGs |
04.Quality Education   08.Decent Work and Economic Growth   09.Industry, Innovation and Infrastructure | include experience courses:N |
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