NCHU Course Outline
Course Name (中) 精密加工(5117)
(Eng.) Precision Fabrication
Offering Dept Department of Mechanical Engineering
Course Type Elective Credits 3 Teacher TSAI, JHY-CHERNG
Department Department of Mechanical Engineering/Undergraduate Language Chinese Semester 2024-FALL
Course Description 本課程介紹各式精密加工技術、原理及其現況與發展，內容包括精密加工概論、精密切削加工、能量束加工、電化學加工以及微機電系統與微細加工，以使修習學生具備精密加工所需之相關知識。
Prerequisites
self-directed learning in the course Y
Relevance of Course Objectives and Core Learning Outcomes(%) Teaching and Assessment Methods for Course Objectives
Course Objectives Competency Indicators Ratio(%) Teaching Methods Assessment Methods
1. 本課程目標在於讓學生習得精密加工與製造之知識及其基本原理與應用，並透過期末專題，養成學生自我學習的態度。
1.The ability to apply the knowledge of math, science, and mechanical engineering.
4.The ability humanities awareness and a knowledge of contemporary issues, and to understand the impact of science and engineering technologies, environmental, societal, and global context.
5.The ability of continuing study and self-learning.
6.The knowledge of professional ethics and social responsibilities of a mechanical engineer.
75
5
15
5
Visit
Lecturing
topic Discussion/Production
Assignment
Quiz
Written Presentation
Oral Presentation
Course Content and Homework/Schedule/Tests Schedule
Week Course Content
Week 1 9/6 Semicon Taiwan 參觀 (全天)
精密度與誤差、精密加工概論
Week 2 接觸加工：精密切削加工一
Week 3 接觸加工：精密切削加工二
Week 4 接觸加工：磨削、研磨與拋光一
Week 5 接觸加工：磨削、研磨與拋光二
Week 6 接觸加工：脆性材料加工
Week 7 期中測驗
Week 8 能量束加工：放電加工、線切割放電加工
Week 9 能量束加工：雷射加工、電子束加工、電漿加工
Week 10 電化學加工：化學蝕刻加工、化學銑削、電解加工
Week 11 自主學習：台中工具機展
Week 12 複合加工：微影蝕刻加工、LIGA
Week 13 複合加工應用：精密加工與IC製程
Week 14 微感測器與微系統製程
Week 15 奈米科技
Week 16 期末測驗
Week 17 專題口頭報告、繳交專題報告
Week 18 自主學習：專題探討
Evaluation
作業與心得報告：20%
期中測驗：25%
學期測驗：30%
期末專題報告：25%
Textbook & other References
參考書目：
1. D. Dornfeld and D. E. Lee, Precision Manufacturing, Springer, 2008.
2. M. J. Madou, Fundamentals of Microfabrication: The Science of Miniaturization, 2nd ed., 2002, CRC Press.
3. H. Nakazawa, Principle of Precision Engineering, translated by R. Takeguchi, 1994, Oxford University Press.
4. M. Jouaneh and S. S. Rangwala, Precision Machining: Technology and Machine Development and Improvement, 1992, ASME Press.
5. 超精密加工編集委員會編，超精密加工の基礎と實際，日刊工業新聞社初版，2006年2月初版。
6. I. Kao and C. Chung, Wafer Manufacturing – Shaping of Single Crystal Silicon Wafers, Willey, 2023.
7. 姜晨、叶卉主编，精密加工技術，華中科技大学出版社，2021。
Teaching Aids & Teacher's Website
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Office Hours
課堂及三(7)
Sustainable Development Goals, SDGs
04.Quality Education   08.Decent Work and Economic Growth   09.Industry, Innovation and Infrastructureinclude experience courses：N
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Update Date, year/month/day：2024/08/30 11:10:34 Printed Date, year/month/day：2024 / 9 / 08
The second-hand book website：http://www.myub.com.tw/