NCHU Course Outline
Course Name (中) 精密加工(5117)
(Eng.) Precision Fabrication
Offering Dept Department of Mechanical Engineering
Course Type Elective Credits 3 Teacher TSAI, JHY-CHERNG
Department Department of Mechanical Engineering/Graduate Language 中/英文 Semester 2025-FALL
Course Description 本課程介紹各式精密加工技術、原理及其現況與發展，內容包括精密加工概論、精密切削加工、能量束加工、電化學加工以及微機電系統與微細加工，以使修習學生具備精密加工所需之相關知識。
Prerequisites
self-directed learning in the course Y
Relevance of Course Objectives and Core Learning Outcomes(%) Teaching and Assessment Methods for Course Objectives
Course Objectives Competency Indicators Ratio(%) Teaching Methods Assessment Methods
1. 本課程目標在於讓學生習得精密加工與製造之知識及其基本原理與應用，並透過期末專題，養成學生自我學習的態度。
1.The ability to solve engineering problems independently with professional knowledge in mechanical engineering.
2.The ability to think innovatively, to design and conduct researches, as well as to present research outcomes.
4.A broader view of international competition/co-operation of industry.
75
15
10
Visit
Lecturing
topic Discussion/Production
Assignment
Quiz
Written Presentation
Oral Presentation
Course Content and Homework/Schedule/Tests Schedule
Week Course Content
Week 1 9/12 Semicon Taiwan 2025 參觀 (全天)
精密度與誤差、精密加工概論
Week 2 精密切削加工：切削原理、機具與刀具、高速切削
Week 3 精密切削加工：精密鑽石車削、鏡面與虹面車削、微細切削
Week 4 精密切削加工：切削顫振、振動輔助切削
Week 5 精密切削加工：磨削、研磨與拋光一
Week 6 精密切削加工：磨削、研磨與拋光二
Week 7 精密切削應用：脆性材料加工、光學透鏡加工
Week 8 期中測驗
Week 9 能量束加工：放電加工、線切割放電加工
Week 10 能量束加工：雷射加工、電子束加工、電漿加工
Week 11 電化學加工：化學蝕刻加工、化學銑削、電解加工
Week 12 複合加工：微影蝕刻加工、LIGA
Week 13 複合加工應用：精密加工與IC製程
Week 14 微感測器與微系統製程
Week 15 奈米科技
Week 16 期末測驗
(專題探討與報告)
self-directed
learning		    01.Participation in professional forums, lectures, and corporate sharing sessions related to industry-government-academia-research exchange activities.
   03.Preparing presentations or reports related to industry and academia.
Evaluation
作業與報告：20%
期中測驗：25%
學期測驗：30%
專題報告：25%
Textbook & other References
參考書目：
1. 課程講義
2. D. Dornfeld and D. E. Lee, Precision Manufacturing, Springer, 2008.
3. M. J. Madou, Fundamentals of Microfabrication: The Science of Miniaturization, 2nd ed., 2002, CRC Press.
4. H. Nakazawa, Principle of Precision Engineering, translated by R. Takeguchi, 1994, Oxford University Press.
5. M. Jouaneh and S. S. Rangwala, Precision Machining: Technology and Machine Development and Improvement, 1992, ASME Press.
6. 超精密加工編集委員會編，超精密加工の基礎と實際，日刊工業新聞社初版，2006年2月初版。
7. I. Kao and C. Chung, Wafer Manufacturing – Shaping of Single Crystal Silicon Wafers, Willey, 2023.
8. 姜晨、叶卉主编，精密加工技術，華中科技大学出版社，2021。
Teaching Aids & Teacher's Website
課堂講義、課程投影片、教學影片、本校數位教學平台i-Learning
Office Hours
課堂及三(7)
Sustainable Development Goals, SDGs(Link URL)
01.Participation in professional forums, lectures, and corporate sharing sessions related to industry-government-academia-research exchange activities.
   03.Preparing presentations or reports related to industry and academia.
   08.Decent Work and Economic Growth   09.Industry, Innovation and Infrastructure		include experience courses：N
Please respect the intellectual property rights and use the materials legally.Please respect gender equality.
Update Date, year/month/day：2025/06/18 16:22:31 Printed Date, year/month/day：2025 / 6 / 18
The second-hand book website：http://www.myub.com.tw/