Course Name |
(中) 先進3D IC堆疊技術(7508) |
(Eng.) Advanced 3D Integration Technology |
Offering Dept |
Engineering |
Course Type |
Elective |
Credits |
1 |
Teacher |
Undefined |
Department |
Engineering |
Language |
English |
Semester |
2025-FALL |
Course Description |
3D packaging technology involves multiple disciplines, for example materials science, mechanical engineering, physics, chemistry, and electrical engineering. A comprehensive introduction of 3D mic roelectronic packaging technology is desirable for graduate students and professionals in both academic and industry area. This course will deal with the following technologies o f 3D integration the fundamentals of interconnects, bonding process, advanced packaging materials, thermal management, architecture design, quality and reliability, and failure analysis of 3D packages, which are critical for the success of advanced 3D packaging. |
Prerequisites |
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self-directed learning in the course |
Y |
Relevance of Course Objectives and Core Learning Outcomes(%) |
Teaching and Assessment Methods for Course Objectives |
Course Objectives |
Competency Indicators |
Ratio(%) |
Teaching Methods |
Assessment Methods |
To understand the content of each technology of MEMS. To understand the characteristics of the device fabricated by MEMS technology. |
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Written Presentation |
Quiz |
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Course Content and Homework/Schedule/Tests Schedule |
Week |
Course Content |
Week 1 |
Day1-Introduction to 3D microelectronic packaging |
Week 2 |
Day2-3D packaging architectures and assembly process design |
Week 3 |
Day3-Fundamentals of bonding technology and process materials for 2.5D/3D packages |
Week 4 |
Day4-Interc onnect quality and reliability of 3D packaging |
Week 5 |
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Week 6 |
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Week 7 |
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Week 8 |
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Week 9 |
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Week 10 |
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Week 11 |
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Week 12 |
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Week 13 |
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Week 14 |
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Week 15 |
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Week 16 |
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self-directed learning |
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Evaluation |
(1) Report: 50%
(2) Examination: |
Textbook & other References |
Electronics data prepared by Prof. Inoue |
Teaching Aids & Teacher's Website |
Power point presentation and blackboard. |
Office Hours |
TBA |
Sustainable Development Goals, SDGs(Link URL) |
| include experience courses:N |
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