NCHU Course Outline

Course Name	(中) 3DIC堆疊之晶圓接合(7505)
	(Eng.) Wafer Bonding Technology for 3D Integration
Offering Dept	Engineering
Course Type	Elective	Credits	1	Teacher	Undefined
Department	Engineering	Language	English	Semester	2024-FALL
Course Description
Prerequisites				self-directed learning in the course	N

Relevance of Course Objectives and Core Learning Outcomes(%)			Teaching and Assessment Methods for Course Objectives
Course Objectives	Competency Indicators	Ratio(%)	Teaching Methods	Assessment Methods
Course Content and Homework/Schedule/Tests Schedule
Week Course Content Week 1 Week 2 Week 3 Week 4 Week 5 Week 6 Week 7 Week 8 Week 9 Week 10 Week 11 Week 12 Week 13 Week 14 Week 15 Week 16 Week 17 Week 18
Evaluation
Textbook & other References
Teaching Aids & Teacher's Website
Office Hours
Sustainable Development Goals, SDGs
include experience courses：N

Please respect the intellectual property rights and use the materials legally.Please repsect gender equality.
Update Date, year/month/day：None	Printed Date, year/month/day：2024 / 11 / 23
The second-hand book website：http://www.myub.com.tw/