| Relevance of Course Objectives and Core Learning Outcomes(%) |
Teaching and Assessment Methods for Course Objectives |
| Course Objectives |
Competency Indicators |
Ratio(%) |
Teaching Methods |
Assessment Methods |
(1)Addresses advanced semiconductor packaging both in theory and practice.
(2)Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging technologies.
(3)Provides in-depth treatment of packaging technologies. |
|
|
|
| Attendance |
| Oral Presentation |
|
| Course Content and Homework/Schedule/Tests Schedule |
| Week |
Course Content |
| Week 1 |
Advanced Packaging |
| Week 2 |
System-in-Package (SiP) |
| Week 3 |
Fan-In Wafer/Panel-Level Chip-Scale Packages |
| Week 4 |
Fan-Out Wafer/Panel-Level Packaging |
| Week 5 |
2D, 2.1D, and 2.3D IC Integration |
| Week 6 |
2.5D IC Integration |
| Week 7 |
3D IC Integration and 3D IC Packaging(1) |
| Week 8 |
3D IC Integration and 3D IC Packaging(2) |
| Week 9 |
Hybrid Bonding(1) |
| Week 10 |
Hybrid Bonding(2) |
| Week 11 |
Chiplet Heterogeneous Integration(1) |
| Week 12 |
Chiplet Heterogeneous Integration(2) |
| Week 13 |
Low Loss Dielectric Materials(1) |
| Week 14 |
Low Loss Dielectric Materials(2) |
| Week 15 |
Advanced Packaging Trends(1) |
| Week 16 |
Advanced Packaging Trends(2) |
| Week 17 |
Participate in professional forums, lectures, enterprise sharing, and other industry-government-university-research-related activities. (Self-learning (1)) |
| Week 18 |
Browse industrial and academic-related multimedia materials. (Self-learning (2)) |
|
| Evaluation |
Attendance & SELF-LEARNING (30%)
Oral Presentation (70%) |
| Textbook & other References |
1. Semiconductor Advanced Packaging, John H. Lau, Springer.
2. Interconnect Reliability in Advanced Memory Device Packaging, Chong Leong, Gan and Chen-Yu, Huang, Springer. |
| Teaching Aids & Teacher's Website |
| https://lms2020.nchu.edu.tw/course/33481 |
| Office Hours |
| Tuesday 15:00-17:00 |
| Sustainable Development Goals, SDGs |
| 08.Decent Work and Economic Growth 09.Industry, Innovation and Infrastructure | include experience courses：N |
|