| Relevance of Course Objectives and Core Learning Outcomes(%) |
Teaching and Assessment Methods for Course Objectives |
| Course Objectives |
Competency Indicators |
Ratio(%) |
Teaching Methods |
Assessment Methods |
| This course is the introduction of the intricate details of 3D process technology. The main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing. All the subjects are from a technological and materials science perspective. |
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| Course Content and Homework/Schedule/Tests Schedule |
| Week |
Course Content |
| Week 1 |
Day1-Advanced Microelectronic Packaging w/o TSV (FOWLP etc.)
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| Week 2 |
Day2-3D Integration with TSV/TGV incl. Chiplets Part 1 |
| Week 3 |
Day3-3D Integration with TSV/TGV incl. Chiplets Part 2 or Reliability Cha racterizatio n of 3D IC |
| Week 4 |
Day4-Self Assembly and Micro LED Integration |
| Week 5 |
Day5-Flexible Electronics and Flexible Hybrid Electronics (FHE) |
| Week 6 |
Day6-Report and examination |
| Week 7 |
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| Week 8 |
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| Week 9 |
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| Week 10 |
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| Week 11 |
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| Week 12 |
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| Week 13 |
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| Week 14 |
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| Week 15 |
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| Week 16 |
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| Week 17 |
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| Week 18 |
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| Evaluation |
| Oral report and examination |
| Textbook & other References |
| 3D Process Technology, ed. Philip Garrou, Mitsumasa Koyanagi, Peter Ramm, Wiley Blackwell , 2014 |
| Teaching Aids & Teacher's Website |
| To be submitted |
| Office Hours |
| To be determined |
| Sustainable Development Goals, SDGs |
| include experience courses：N |
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