| Course Name |
(中) 半導體晶圓製造之科學與工程基礎(7501) |
| (Eng.) Science & Engineering Foundations for Semiconductor Wafer Manufacturing |
| Offering Dept |
Engineering |
| Course Type |
Elective |
Credits |
1 |
Teacher |
All |
| Department |
Engineering |
Language |
English |
Semester |
2025-FALL |
| Course Description |
Prime wafers are fundamental to semiconductor fabrication in today’s electronics industry. This course presents principles and applications of engineering and sciences in producing crystalline wafers including diffusion, doping, chemical etching, electrochemical processes, abrasive machining processes, mechanochemical processes, slicing, grinding, lapping, and chemical-mechanical polishing (CMP). Academic research with industrial relevance will be presented to understand the status-quo and future of this field. |
| Prerequisites |
|
self-directed learning in the course |
N |
| Relevance of Course Objectives and Core Learning Outcomes(%) |
Teaching and Assessment Methods for Course Objectives |
| Course Objectives |
Competency Indicators |
Ratio(%) |
Teaching Methods |
Assessment Methods |
| This short course is in-tended to equip stu-dents with knowledge in silicon wafer manu-facturing, including wafer manufacturing processes and im-portant properties/in-dexes in the process. |
|
|
|
| Written Presentation |
| Assignment |
| Quiz |
|
| Course Content and Homework/Schedule/Tests Schedule |
| Week |
Course Content |
| Week 1 |
第1天-Introduction of wafer manufacturing & semiconductor revolution
第2天-Engineering and science in semiconductor wafering and fabrication
第3天-SEMI standards of wafers & relevant technology in fabrication
第4天-Processes of wafering: crystal growth, forming, polishing, preparing |
| Week 2 |
第5天-Engineering process modeling
第6天-Relevant research of wafer manufacturing processes/ Final exam |
| Week 3 |
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| Week 4 |
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| Week 5 |
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| Week 6 |
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| Week 7 |
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| Week 8 |
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| Week 9 |
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| Week 10 |
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| Week 11 |
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| Week 12 |
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| Week 13 |
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| Week 14 |
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| Week 15 |
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| Week 16 |
|
self-directed
learning |
無自主學習內容 |
|
| Evaluation |
| Assignment 25%, Term Report 25%, Final exam 50% |
| Textbook & other References |
| I. Kao and C. Chung, Wafer Manufacturing – Shaping of Single Crystal Silicon Wafers, Willey, 2023. |
| Teaching Aids & Teacher's Website |
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| Office Hours |
| After class |
| Sustainable Development Goals, SDGs(Link URL) |
| 09.Industry, Innovation and Infrastructure | include experience courses：N |
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