| 課程與核心能力關聯配比(%) |
課程目標之教學方法與評量方法 |
| 課程目標 |
核心能力 |
配比(%) |
教學方法 |
評量方法 |
| To understand and apply industry specific vocabulary related to semiconductor manufacturing processes, to gain the broad understanding of the basic IC fabrication sequence covering essential stages such as wafer manufacturing, photolithography, etching, and thin film deposition, to gain practical knowledge for a career in semiconductor manufacturing and finally to unlock career development opportunities in the dynamic semiconductor industry. |
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| 授課內容(單元名稱與內容、習作/每週授課、考試進度-共18週) |
| 週次 |
授課內容 |
| 第1週 |
Introduction and Historical Perspective |
| 第2週 |
Introduction to Integrated Circuit |
| 第3週 |
Semiconductor Basics |
| 第4週 |
Wafer Manufacturing |
| 第5週 |
Thermal Processes |
| 第6週 |
Lithography |
| 第7週 |
Plasma Basics |
| 第8週 |
Midterm Exam |
| 第9週 |
Ion Implantation |
| 第10週 |
Etching |
| 第11週 |
Chemical Vapor Deposition |
| 第12週 |
Metallization |
| 第13週 |
Chemical Mechanical Polishing |
| 第14週 |
Process Integration |
| 第15週 |
Integrated Circuit Processing Technologies |
| 第16週 |
Final Exam |
| 第17週 |
Independent Learning: In-depth self-study in relevant literature, research papers, and industry reports related to semiconductor manufacturing technology |
| 第18週 |
Independent Learning: Written report and oral presentation about the topics of self-study (team work) |
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| 學習評量方式 |
1. Homework 10%
2. Group Discussion 10% (Team work)
3. Written Report and Oral Presentation 20% (Team work)
4. Midterm Exam 30%
5. Final Exam 30%
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| 教科書＆參考書目(書名、作者、書局、代理商、說明) |
1. Hong Xiao, “Introduction to Semiconductor Manufacturing Technologies”, 2nd Edition, Society of Photo-Optical Instrumentation Engineers (SPIE), 2012.
2. J. D. Plummer, M. D. Deal, and P. B. Griffin, “Silicon VLSI Technology: Fundamentals, Practice and Modeling”, Prentice Hall, 2000.
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| 課程教材（教師個人網址請列在本校內之網址） |
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| 課程輔導時間 |
| Tuesday 13:10-16:00 |
| 聯合國全球永續發展目標 |
| 04.教育品質 08.就業與經濟成長 09.工業、創新基礎建設 | 提供體驗課程：N |
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