| Relevance of Course Objectives and Core Learning Outcomes(%) |
Teaching and Assessment Methods for Course Objectives |
| Course Objectives |
Competency Indicators |
Ratio(%) |
Teaching Methods |
Assessment Methods |
| 使學生充分了解半導體元件製作的各種製程以及應用方式 |
|
|
|
|
| Course Content and Homework/Schedule/Tests Schedule |
| Week |
Course Content |
| Week 1 |
第一章 導論、第二章 積體電路製程介紹 |
| Week 2 |
第三章 半導體基礎
|
| Week 3 |
第四章 晶圓製造
|
| Week 4 |
第五章 加熱製程
|
| Week 5 |
第六章 微影製程 I |
| Week 6 |
國慶日調整休假 |
| Week 7 |
第六章 微影製程 II |
| Week 8 |
期中考 |
| Week 9 |
第七章 電漿製程 I
|
| Week 10 |
第七章 電漿製程 II
|
| Week 11 |
第八章 離子佈植製程 |
| Week 12 |
第九章 蝕刻製程 I
|
| Week 13 |
第九章 蝕刻製程 II
|
| Week 14 |
第十章 化學氣相沉積與介電質薄膜 I
|
| Week 15 |
第十章 化學氣相沉積與介電質薄膜 II
|
| Week 16 |
第十一章 金屬化製程、第十二章 化學機械研磨製程
|
| Week 17 |
第十三章 半導體製程整合、第十四章 IC製程技術
|
| Week 18 |
期末考
|
|
| Evaluation |
Midterm 40%
Final 40%
Participation: 20% |
| Textbook & other References |
Hong Xiao Introduction to Semiconductor Manufacturing Technology
Publisher : Prentice Hall; United States Ed edition (January 1, 2000)
Language : English
Hardcover : 647 pages
ISBN-10 : 0130224049
ISBN-13 : 978-0130224040 |
| Teaching Aids & Teacher's Website |
| Ilearning 3.0 |
| Office Hours |
| Monday 5, 6 節 |
| Sustainable Development Goals, SDGs |
| 09.Industry, Innovation and Infrastructure | include experience courses：N |
|