| 週次 |
授課內容 |
| 第1週 |
Patterning by optical, X-Ray, and E-Beam lithography. |
| 第2週 |
Patterning by optical, X-Ray, and E-Beam lithography. |
| 第3週 |
Selective wet etching processes. |
| 第4週 |
Selective wet etching processes. |
| 第5週 |
Directional dry etching processes. |
| 第6週 |
Directional dry etching processes. |
| 第7週 |
Thin-film deposition by evaporation. |
| 第8週 |
Thin-film deposition by evaporation. |
| 第9週 |
Midterm Exam |
| 第10週 |
Sputtering, electroplating, chemical vapor deposition, and laser assisted deposition. |
| 第11週 |
Sputtering, electroplating, chemical vapor deposition, and laser assisted deposition. |
| 第12週 |
Bonding and release of mechanical structures. |
| 第13週 |
Bonding and release of mechanical structures. |
| 第14週 |
Bulk and surface micromachining for MEMS. |
| 第15週 |
Bulk and surface micromachining for MEMS. |
| 第16週 |
Future trends and development in MEMS technology.
Self-directed learning
Project Report
Self-directed learning
Project Report |
自主學習
內容 |
|