| 週次 |
授課內容 |
| 第1週 |
Study the mechanical structure of existing ST MEMS accelerometers (e.g., LSM303AGR, mass-spring system). |
| 第2週 |
Design a cantilever structure adhering to1P6M design rules (e.g., minimum line width, interlayer dielectric materials) using finite element analyses. |
| 第3週 |
Simulate mechanical sensitivity (e.g., displacement vs. acceleration) and resonant frequency. |
| 第4週 |
3D model of the MEMS structure and simulation report (including stress analysis). |
| 第5週 |
Design a capacitive sensing circuit (e.g., differential capacitance-to-voltage converter), considering UMC 1P6M analog circuit constraints (e.g., parasitic capacitance). |
| 第6週 |
Use spice for circuit design and perform co-simulation with the MEMS structure using matlab. |
| 第7週 |
Optimize noise performance and signal chain (e.g., chopper stabilization). |
| 第8週 |
Circuit schematic and post-layout simulation results. |
| 第9週 |
Integrate MEMS and circuit layouts (GDSII file) and verify DRC/LVS using PDK. |
| 第10週 |
Propose a mock-up test plan (e.g., via TSRI’s MPW service). |
| 第11週 |
validate performance using Finite Element Analysis (FEA). |
| 第12週 |
validate performance using Finite Element Analysis (FEA). |
| 第13週 |
validate performance using Finite Element Analysis (FEA). |
| 第14週 |
Complete GDSII file |
| 第15週 |
Manufacturability report (including cost and yield estimates). |
| 第16週 |
Final report |
自主學習
內容 |
01.參與專業論壇、講座、企業分享等產官學研相關交流活動
03.製作專題報告
|