| 課程與核心能力關聯配比(%) |
課程目標之教學方法與評量方法 |
| 課程目標 |
核心能力 |
配比(%) |
教學方法 |
評量方法 |
(1)Addresses advanced semiconductor packaging both in theory and practice.
(2)Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging technologies.
(3)Provides in-depth treatment of packaging technologies. |
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| 授課內容(單元名稱與內容、習作/每週授課、考試進度-共18週) |
| 週次 |
授課內容 |
| 第1週 |
Advanced Packaging |
| 第2週 |
System-in-Package (SiP) |
| 第3週 |
Fan-In Wafer/Panel-Level Chip-Scale Packages |
| 第4週 |
Fan-Out Wafer/Panel-Level Packaging |
| 第5週 |
2D, 2.1D, and 2.3D IC Integration |
| 第6週 |
2.5D IC Integration |
| 第7週 |
3D IC Integration and 3D IC Packaging(1) |
| 第8週 |
3D IC Integration and 3D IC Packaging(2) |
| 第9週 |
Hybrid Bonding(1) |
| 第10週 |
Hybrid Bonding(2) |
| 第11週 |
Chiplet Heterogeneous Integration(1) |
| 第12週 |
Chiplet Heterogeneous Integration(2) |
| 第13週 |
Low Loss Dielectric Materials(1) |
| 第14週 |
Low Loss Dielectric Materials(2) |
| 第15週 |
Advanced Packaging Trends(1) |
| 第16週 |
Advanced Packaging Trends(2) |
| 第17週 |
Participate in professional forums, lectures, enterprise sharing, and other industry-government-university-research-related activities. (Self-learning (1)) |
| 第18週 |
Browse industrial and academic-related multimedia materials. (Self-learning (2)) |
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| 學習評量方式 |
Attendance & SELF-LEARNING (30%)
Oral Presentation (70%) |
| 教科書＆參考書目(書名、作者、書局、代理商、說明) |
1. Semiconductor Advanced Packaging, John H. Lau, Springer.
2. Interconnect Reliability in Advanced Memory Device Packaging, Chong Leong, Gan and Chen-Yu, Huang, Springer. |
| 課程教材（教師個人網址請列在本校內之網址） |
| https://lms2020.nchu.edu.tw/course/33481 |
| 課程輔導時間 |
| Tuesday 15:00-17:00 |
| 聯合國全球永續發展目標 |
| 08.就業與經濟成長 09.工業、創新基礎建設 | 提供體驗課程：N |
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